【Features】
• Prober compatibility: The VA-3200 image inspection system is designed to be mounted on a probe machine, allowing engineers and operators to use it in a familiar equipment environment.
• Simplify the operation process: The integration of the system and the needle test machine allows users to use the existing operation interface to set image parameters, reducing the learning curve for the new system.
• Avoid the risk of wafer breakage: Since there is no need to directly contact the wafer for picking and placing, the risk of wafer breakage is effectively prevented.
• Improved operational convenience: Engineers and operators who are familiar with needle testing machines can get started more easily, maintaining the efficiency and safety of the inspection process.
【Product advantages】
1. High-quality image capture
◦ Line Scan Camera: Using a line scan camera, it provides a large field of view (FOV) and fast scanning capabilities, and can completely capture the image of the entire wafer in a short time.
◦ 3x lens: Used with a high-magnification lens, it can produce high-quality images and significantly improve the recognition rate of defect features.
2. High-precision defect detection
◦ Detection accuracy reaches 5μm: It has high-precision detection capabilities and can accurately identify tiny defects on the wafer surface, including foreign objects (Particles), scratches (Scratches), Pad anomalies and Bump anomalies.
