Product Description
Sputtering target is mainly used in electronics and information industry, such as integrated circuits, information storage, LIQUID crystal display, laser memory, electronic control devices, etc. Can also be used in glass coating field; It can also be used in wear-resistant materials, high temperature corrosion resistance, high-grade decorative products and other industries.
Chemical Component
Grade |
N |
C |
H |
Fe |
O |
Residuals Elelement |
Max Total |
Gr1 | 0.03 | 0.08 | 0.015 | 0.2 | 0.18 | 0.1 | 0.4 |
Physical Property
Grade |
Tensile strength,Mpa (min) |
Yield strength,MPa (min) |
Elongation, % (min) |
Reduction of Area, % (min) |
|||
Gr1 | 240 | 138~20 | 24 | 30 |
Product Features
purity
Purity is one of the main performance index of target material,because the purity of target material had a great influence on the performance of the film.
In practice, however, also have different requirements for the purity of target material.
impurity content
Solid impurities in the target material and the porosity of oxygen and moisture are the main sources of deposition film.
Different USES of the target material have different requirements of different impurity content.
For example, semiconductor industrial pure aluminum and aluminum alloy material, the alkali metal content and radioactive element content have special requirements.
density
In order to reduce the porosity of solid target material, improve the performance of the sputtering film usually require target material with high density. The density of the target material not only affect the sputtering rate, but also affects the electrical and optical properties of film. The higher the density of target, the performance of the film, the better.
Round shape titanium aluminum arcing cathodeSize: diameter 127mm and 15mm thickness
Popular standard size or OEM machining
Advantage:
(1) Smooth surface without pore,scratch and other imperfection
(2) Grinding or lathing edge, no cutting marks
(3) Unbeatable level of material purity
(4) High ductility
(5) Homogeneous micro structure
(6) Laser marking for your special Item with name, brand, purity size and so on
(7)Every pcs of sputtering targets from the powder materials item&number, mixing workers,outgas and HIP time,machining person and packing details are all made ourselves.
All of those step can promise you once a new sputtering target or method is created ,it could be copied and kept to support a stable quality products.
Two
Strong toughness and high hardness
Three
High temperature and low temperature resistance