Soft hard multilayer circuit board：8Layer pcb circuit

PRODUCT PICTURE
Dongguan Yaocheng Electronic Technology Co., Ltd.

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COMPANY PROFILE
Dongguan Yaocheng Electronic Technology Co., Ltd.

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Dongguan Yaocheng Electronic Technology Co., Ltd. is a wholly-owned Hong Kong company (Weiyuanda Industrial Co., Ltd), which provides global PCB fast proofing, small and medium batch circuit board production and manufacturing enterprises. The factory is located in Chang’an, Dongguan, just one bridge to Shenzhen Apart. The factory has a construction area of 10,000 square meters, a monthly production capacity of 20,000 square meters, and a monthly production of up to 5,000 varieties. Committed to becoming a world-class service provider for medium and small batch circuit boards and model brands of circuit boards.

Certifications
Dongguan Yaocheng Electronic Technology Co., Ltd.

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TRADE INFORMATION
Dongguan Yaocheng Electronic Technology Co., Ltd.

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FAQ
Dongguan Yaocheng Electronic Technology Co., Ltd.

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Capability:
Monthly output Capacity: 5,000 sqM for Multilayer
Layer Count: 2-30 Layers
Products Type:
FR4 、HF (High Frequency) & RF (Radio Frequency) board, Impedance controlled board 

Material:
Laminate:  FR4 
HF material:  Rogers, Taconic, Arlon
High TG material:   ITEQ / IT180 and related PP
Halogen Free material:  SHENGYI / S1155 / S1165
Solder Mask:  Taiyo PSR 2000/4000
Plating Chemistry:  ROHM & HASS

Surface Finish:
Leaded HAL, Lead free HAL, ENIG, OSP (Entek), Immersion Tin,
Immersion Silver, Hard Gold(50u")

Selective Surface Treatment:
ENIG + OSP, ENIG + Gold Fingers, Immersion Silver + Gold Fingers,
Immersion Tin + Gold Fingers

Technical Specification
Min. Trace Width/Space: 3/3mil (outer layer, finished copper 30um), 2.5/2.5mil(inner layer, 1/3 or 1/2 OZ)
Min. Hole Size: 0.15mm/6mil (mechanical drill), 0.1mm/4mil (laser drill)
Min. Annular Ring: 4mil
Min. Distance Between Layers: 2mil
Max. Finished Copper Thickness: 7 OZ
Max. Finished Board Size: 600X800mm / 23.5"*32.5"
Finished Board Thickness:  Double Sided: 0.2-7.0mm / 0.008"-0.28", Multilayer: 0.40-7.0 mm / 0.016"-0.28",
Min. Solder Mask Bridge: ≥0.08mm
Aspect ratio: 16:1
Plugging Vias Capability: 0.2-0.8mm

Tolerance :
Plated holes Tolerance: ±0.075mm （min.±0.05）
Non-plated hole tolerance: ±0.05mm (min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance: ±0.1mm(mils±0.05-0.075mm)

Functional Test:
Insulation Resistance: 50 ohms (standard)
Peel Off Strength: 1.4N/mm
Thermal Shock Test: 280 degrees F, 20 seconds
Solder Mask Hardness: ≥6H
E-Test Voltage: 10V-250V
Warp and Twist: ≤0.7%

Certification:
ISO,UL,ISO9001,ISO14001, UL