Technical parameters and
process capability of metal substarte(MCPCB)
|
ITEM
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SPECIFICATION
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Surface
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LF HASL,immersion gold,immersion
siliver,OSP
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Layer
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Single side,double sided Multilayer and
special structure
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Maximum PCB size
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240mmx1490mm OR 490x1190mm
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PCB thickness
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0.4-3.0mm
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Copper Foil thickness
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H 1/2/3/4(oz)
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Insulation layer thickness
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50/75/100/125/150/175/200(um)
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Metal Base thickness
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AIuminum(1100/3003/5052/6061),Copper
AIuminum
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Metal Base thickness
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0.5/0.8/1.0/1.2/1.6/2.0/3.2/5.0(mm)
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Shaping
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Die punching/CNC Route/V-Cut
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Test
|
100% open&short test
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Shaping tolerance
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Die Punching<+- 0.05mm,CNC
Route<+-0.15mm,V-CUT Thick residue>+-0.15mm
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Hole tolerance
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+-0.5mm
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Min.Hole DIameter
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Single side 0.5/Double sided PTH0.3MM
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Solder mask
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green/white/black/red/yellow
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Min.letter height
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0.8mm
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Min.line space
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0.15
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Min.letter width
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0.15
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Sile screen color
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blue/white/black/red/yellow
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Sopecial hole
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Spot facing/cup hole/buried via
hole/buried tank
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File format
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Gerber,Protel,PowerPCB,AutoCAD etc
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